Google’s Tensor G4 SoC to Use FOWLP for Heat Management & Power Efficiency. Google Pixel 8 and Pixel 8 Pro launched in October with Tensor G3 chipsets and artificial intelligence (AI) features. Just a few months after their launch, numerous online leaks revealed details about the upcoming Pixel phones.
The Tensor G4, Google’s next-generation SoC, is expected to power the Pixel 9 and Pixel 9 Pro. According to reports, the chipset would be built on Samsung’s most recent 4nm process and would provide better heat management and power efficiency.
Google will integrate Samsung Electronics’ 4-nano microprocessing technology into the Tensor G4 chipset, which will be used in the next generation of Pixel phones, according to a report published by the Korean news outlet FNN. According to reports, the Tensor G4 would employ FOWLP, or fan-out wafer level packaging, a sophisticated packing technique. It is claimed that this kind of packing enhances semiconductor heat generation while also boosting performance and power efficiency. This would be a significant upgrade over the Tensor G3 SoC from the previous year.
Additionally, according to the report, Samsung employed the 4nm process for the Exynos 2400 chipsets included in the Galaxy S24 and Galaxy S24+ models. According to the report, the phones did well in the few markets where they were introduced.
It was previously predicted that the Tensor G4 SoC would offer slight performance improvements over the Tensor G3 SoC.
Android 14 powers Google’s Pixel 8 and Pixel 8 Pro smartphones. A 6.2-inch full-HD+ (1,080×2,400 pixel) OLED screen with a refresh rate of 120Hz is included on the vanilla model. In contrast, the Pixel 8 Pro sports a 6.7-inch Quad-HD (1,344×2,992 pixel) OLED display with a refresh rate of 120 Hz. They are powered by the Titan M2 security chip and Google’s Tensor G3 chipset.